DocumentCode :
2663115
Title :
3-D Stacking Using the GE High Density Multichip Module Technology
Author :
Saia, R.J. ; Wojnarowski, R.J. ; Fillion, R.A. ; Forman, G.A. ; Gorowitz, B.
Author_Institution :
General Electric Company, NY
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
285
Lastpage :
292
Keywords :
Delay; Dielectric substrates; Dielectric thin films; Distributed processing; Integrated circuit interconnections; Multichip modules; Packaging; Performance loss; Research and development; Stacking;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753564
Filename :
753564
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663115
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