Title :
Thin Film Programmable Interconnect Arrays
Author :
Frazier, A. Bruno ; Powers, Richard M. ; Allen, Mark G.
Author_Institution :
Georgia Institute of Technology
Keywords :
Costs; Electrodes; Impedance; Inorganic materials; Integrated circuit interconnections; Integrated circuit packaging; Polyimides; Power system interconnection; Semiconductor device packaging; Transistors;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753565
