Title :
Interconnection Considerations for a Hybrid Mcm
Author :
Noren, Jolanta ; Brofman, Peter
Author_Institution :
IBM Microelectronics, NY
Keywords :
Assembly; Bonding; Electronics packaging; Flip chip; Hybrid integrated circuits; Integrated circuit interconnections; Microelectronics; Surface-mount technology; Transistors; Wire;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753566
