DocumentCode :
2663227
Title :
MCM-L Cost Model & Application Case Study
Author :
Begay, Marlene J. ; Cantwell, Robert
Author_Institution :
DSC Communications Corporation, TX
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
332
Lastpage :
337
Keywords :
Application specific integrated circuits; Computer aided software engineering; Costs; Multichip modules; Packaging machines; Plastic packaging; Semiconductor device packaging; Switches; System analysis and design; Telecommunication switching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753571
Filename :
753571
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663227
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