DocumentCode :
2663249
Title :
Evaluation of Non-Hermetic Coatings for Mcm Applications through Hast, 85/85 and Pct
Author :
Murphy, Cynthia F. ; Kodnani, Ramesh ; Peterson, David W.
Author_Institution :
Lehigh University, PA
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
338
Lastpage :
343
Keywords :
Bonding; Circuit testing; Coatings; Electronics packaging; Humidity; Materials testing; Microelectronics; Military computing; Multichip modules; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753572
Filename :
753572
Link To Document :
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