Title :
Evaluation of Non-Hermetic Coatings for Mcm Applications through Hast, 85/85 and Pct
Author :
Murphy, Cynthia F. ; Kodnani, Ramesh ; Peterson, David W.
Author_Institution :
Lehigh University, PA
Keywords :
Bonding; Circuit testing; Coatings; Electronics packaging; Humidity; Materials testing; Microelectronics; Military computing; Multichip modules; Temperature;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753572