DocumentCode :
2663281
Title :
Stress Development During High Dielectric Ceramic Thin Films Processing
Author :
Boggs, Karl E. ; Wilcox, David L. ; Payne, David A. ; Allen, Les H.
Author_Institution :
University of Illinois, Urbana-Champaign
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
350
Lastpage :
355
Keywords :
Capacitance; Capacitors; Ceramics; Dielectric materials; Dielectric substrates; Dielectric thin films; Ferroelectric materials; Packaging; Stress; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753574
Filename :
753574
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663281
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