DocumentCode :
2663296
Title :
Fabrication, Assembly, and Characterization of Stacked Multichip Modules Using Hot Pressed, Co-Fired Aluminum Nitride
Author :
Minehan, W.T. ; Weidner, W.K. ; Jensen, R.J. ; Spielberger, R.K. ; Jacobsen, W.F. ; Speerschneider, C.J.
Author_Institution :
Coors Electronic Package Company, TN
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
356
Lastpage :
361
Keywords :
Aluminum nitride; Assembly; Ceramics; Electronic packaging thermal management; Fabrication; Integrated circuit interconnections; Integrated circuit packaging; Multichip modules; Stacking; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753575
Filename :
753575
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663296
بازگشت