Title :
Notice of Retraction
A new truly meshless metod for heat conduction in solid structures
Author :
Sheikhy, N. ; Ahmadi, I.
Author_Institution :
Sch. of Mech., Islamic Azad Univ., Hidaj, Iran
Abstract :
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
In this study a new meshless method is presented for the analysis of heat transfer in heterogeneous solid structures. The presented meshless method is based on the integral form of energy equation for the sub-particles in the domain of the material. A micromechanical model based on the presented meshless method is presented for analysis of heat transfer, temperature distribution and steady-state effective thermal conductivities of fiber-matrix type of composite materials. Because the domain integration is eliminated in the presented meshless formulation, the computational efforts in presented method are decreased substantially. A small area of the composite system called the representative volume element (RVE) is considered as the solution domain. The fully bonded fiber-matrix interface is considered and contact thermal resistant is neglected in the fiber-matrix interface and so the continuity of temperature and reciprocity of heat flux is satisfied in the fiber-matrix interface. A direct interpolation method is employed for enforcement the appropriate boundary conditions to the RVE. Numerical results are presented for temperature distribution, heat flux and thermal conductivity. Numerical results show that presented meshless method is simple, effective, accurate and less costly method in micromechanical modeling of heat conduction in heterogeneous materials.
Keywords :
fibre reinforced composites; interpolation; micromechanics; temperature distribution; thermal conductivity; thermal resistance; boundary conditions; direct interpolation method; energy equation; fiber-matrix type composite materials; fully bonded fiber-matrix interface; heat conduction; heat flux; heat transfer; heterogeneous solid structure; micromechanical model; representative volume element; steady-state effective thermal conductivity; temperature distribution; truly meshless method; Bonding; Composite materials; Conducting materials; Heat transfer; Integral equations; Interconnected systems; Micromechanical devices; Steady-state; Temperature distribution; Thermal conductivity; Fibrous composites; Heat transfer; Micromechanical model; Thermal conductivity; Truly meshless method;
Conference_Titel :
Computer Engineering and Technology (ICCET), 2010 2nd International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-6347-3
DOI :
10.1109/ICCET.2010.5486166