Evaluation of Ionic Salt Photodefinable Polyimides As Mcm-D Dielectrics with Copper Metallization

Author

Lazaridis, C.N. ; Flattery, D.K. ; Lautenberger, W.J. ; Yamamoto, Y.S. ; Imai, K.

Author_Institution

DuPont Electronic Materials, DuPont K. K. Technical Center, Japan

fYear

1994

fDate

13-15 Apr 1994

Firstpage

362

Lastpage

368

Keywords

Adhesives; Copper; Costs; Dielectric materials; Fabrication; Inorganic materials; Metallization; Polyimides; Polymer films; Spine;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

DOI

10.1109/ICMCM.1994.753576

Filename

753576

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