Title :
Development of a Dsp Function Using a Mcm Technology
Author :
Michaud, Michel ; Rames, Jean Claude
Author_Institution :
Matra Defense, France
Keywords :
Assembly; Copper; Costs; Dielectric substrates; Digital signal processing; Packaging; Production; Random access memory; Routing; Surface-mount technology;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753578
