DocumentCode
2663347
Title
Development of a Dsp Function Using a Mcm Technology
Author
Michaud, Michel ; Rames, Jean Claude
Author_Institution
Matra Defense, France
fYear
1994
fDate
13-15 Apr 1994
Firstpage
378
Lastpage
383
Keywords
Assembly; Copper; Costs; Dielectric substrates; Digital signal processing; Packaging; Production; Random access memory; Routing; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN
0-930815-39-4
Type
conf
DOI
10.1109/ICMCM.1994.753578
Filename
753578
Link To Document