DocumentCode

2663359

Title

An Mcm-D Foundry from Copper/polyimid Tfml Bare Substrate to Multichif Modules

Author

Droguet, Jean Paul

Author_Institution

Thomson Hybrides, France

fYear

1994

fDate

13-15 Apr 1994

Firstpage

384

Lastpage

389

Keywords

Conductors; Copper; Dielectrics; Dispersion; Foundries; Ground support; Multichip modules; Nonhomogeneous media; Signal design; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753579

Filename

753579