Title :
An Mcm-D Foundry from Copper/polyimid Tfml Bare Substrate to Multichif Modules
Author :
Droguet, Jean Paul
Author_Institution :
Thomson Hybrides, France
Keywords :
Conductors; Copper; Dielectrics; Dispersion; Foundries; Ground support; Multichip modules; Nonhomogeneous media; Signal design; Testing;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753579
