Title :
Electroless Nickel/Copper Plating as a New Bump Metallization
Author :
Aschenbrenner, R. ; Ostmann, A. ; Beutler, U. ; Simon, J. ; Reichl, H.
Author_Institution :
Technische Universitat, Berlin
Keywords :
Aluminum; Bonding; Copper; Costs; Gold; Integrated circuit packaging; Kinetic theory; Metallization; Nickel; Tin;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753580
