DocumentCode

2663370

Title

Electroless Nickel/Copper Plating as a New Bump Metallization

Author

Aschenbrenner, R. ; Ostmann, A. ; Beutler, U. ; Simon, J. ; Reichl, H.

Author_Institution

Technische Universitat, Berlin

fYear

1994

fDate

13-15 Apr 1994

Firstpage

390

Lastpage

395

Keywords

Aluminum; Bonding; Copper; Costs; Gold; Integrated circuit packaging; Kinetic theory; Metallization; Nickel; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753580

Filename

753580