DocumentCode :
2663393
Title :
Mcm-D Technology for a Communication Application
Author :
Radlik, W. ; Plehnert, K. ; Zellner, M. ; Achen, A. ; Heistand, R., II ; Castillo, D. ; Urscheler, R.
Author_Institution :
The DOW Chemical Company, MI
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
402
Lastpage :
409
Keywords :
Assembly; Capacitors; Chemical technology; Communications technology; Costs; Data communication; Dielectric thin films; Packaging; Resistors; Thin film circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753582
Filename :
753582
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663393
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