DocumentCode :
2663405
Title :
Advanced Mcm-L in Apachip a European Cooperative Program
Author :
Kurzweil, K. ; Wessely, H.
Author_Institution :
Siemens Nixdorf, Germany
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
410
Lastpage :
415
Keywords :
Assembly; Conductors; Cooling; Educational institutions; Electronic packaging thermal management; Electronics packaging; Microelectronics; Packaging machines; Research and development; Semiconductor device packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753583
Filename :
753583
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663405
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