DocumentCode
2663405
Title
Advanced Mcm-L in Apachip a European Cooperative Program
Author
Kurzweil, K. ; Wessely, H.
Author_Institution
Siemens Nixdorf, Germany
fYear
1994
fDate
13-15 Apr 1994
Firstpage
410
Lastpage
415
Keywords
Assembly; Conductors; Cooling; Educational institutions; Electronic packaging thermal management; Electronics packaging; Microelectronics; Packaging machines; Research and development; Semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN
0-930815-39-4
Type
conf
DOI
10.1109/ICMCM.1994.753583
Filename
753583
Link To Document