Title :
Wire Bonding Dual-Sided Mcma Modules
Author :
Anderson, Harold
Author_Institution :
Advanced Packaging Development & Automation Center, Motorola Inc., Arizona
Keywords :
Application specific integrated circuits; Assembly; Bonding; Costs; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Space technology; Substrates; Wire;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753585
