Title :
Integrated Flex: Rigid-Flex Capability in a High Performance Mcm
Author :
Light, David N. ; Kresge, John S. ; Davis, Charles R.
Author_Institution :
IBM Microelectronics, New York
Keywords :
Application software; Cable insulation; Composite materials; Cost function; Dielectrics and electrical insulation; High performance computing; Lead; Microelectronics; Packaging; Voltage;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753586