Title :
Chip on Board Technology for Low Cost Multi-Chip-Modules
Author :
Clot, Philippe ; Sarbach, Pierre ; Styblo, Donald
Author_Institution :
Valtronic USA Inc., Ohio
Keywords :
Cost function; Electronics packaging; Finite element methods; Glass; Heat sinks; Paper technology; Pins; Soldering; Thermal resistance; Thermal stresses;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753589
