Title :
Thin-Profile MCM-D Packaging for Small Form Factor Applications
Author :
Bet-Shliemoun, Ashur ; McGraw, Mark ; Griswold, Brad ; Ho, Chung ; Westbrook, Scott
Author_Institution :
MicroModule Systems, Inc., CA
Keywords :
Assembly; Bonding; Copper; EPROM; Electronics packaging; Polyimides; Semiconductor films; Silicon; Sputtering; Substrates;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753590
