Title :
Non-Digital Extensions of an Embedded Chip MCM Technology
Author :
Fillion, R.A. ; Wojnarowski, R.J. ; Bicknell, W.H. ; Daum, W. ; Forman, G.
Author_Institution :
GE Corporate Research and Development, NY
Keywords :
Dielectric substrates; Dielectric thin films; Digital circuits; Instruments; Integrated circuit interconnections; Lamination; Metallization; Polyimides; Polymer films; Research and development;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753591