DocumentCode :
2663554
Title :
3-D Multichip Packaging for Memory Modules
Author :
Crowley, Robert T. ; Vardaman, E. Jan
Author_Institution :
TechSearch International, Inc., Texas
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
474
Lastpage :
479
Keywords :
Application software; Assembly; Cache memory; Computer applications; Integrated circuit interconnections; Packaging; Signal processing; Solid state circuits; Space technology; Stacking;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753592
Filename :
753592
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663554
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