• DocumentCode
    2663554
  • Title

    3-D Multichip Packaging for Memory Modules

  • Author

    Crowley, Robert T. ; Vardaman, E. Jan

  • Author_Institution
    TechSearch International, Inc., Texas
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    474
  • Lastpage
    479
  • Keywords
    Application software; Assembly; Cache memory; Computer applications; Integrated circuit interconnections; Packaging; Signal processing; Solid state circuits; Space technology; Stacking;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753592
  • Filename
    753592
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2663554