DocumentCode :
2663585
Title :
Capacitively Coupled Multichip Modules
Author :
Salzman, David B. ; Knight, Thomas F.
Author_Institution :
MIT Artificial Intelligence Laboratory
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
487
Lastpage :
494
Keywords :
Backplanes; Costs; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Multichip modules; Packaging machines; Semiconductor device packaging; Substrates; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753594
Filename :
753594
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663585
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