DocumentCode

2663613

Title

Array Module Connector Test Program at Unisys

Author

Kuntz, Ronald J. ; Williams, Scott

Author_Institution

UNISYS, CA

fYear

1994

fDate

13-15 Apr 1994

Firstpage

498

Lastpage

503

Keywords

Assembly; Ceramics; Connectors; Electronics packaging; Life testing; Multichip modules; Performance evaluation; Sockets; Thermal stresses; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753596

Filename

753596