Title :
Array Module Connector Test Program at Unisys
Author :
Kuntz, Ronald J. ; Williams, Scott
Author_Institution :
UNISYS, CA
Keywords :
Assembly; Ceramics; Connectors; Electronics packaging; Life testing; Multichip modules; Performance evaluation; Sockets; Thermal stresses; Wiring;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753596
