DocumentCode
2663624
Title
Cost effective ceramic surface mount packaging for high I/O applications
Author
Miks, Jeff
Author_Institution
Commercial Plus Technologies Operation, Arizona
fYear
1994
fDate
13-15 Apr 1994
Firstpage
504
Lastpage
509
Keywords
Ceramics industry; Costs; Electronics packaging; Fatigue; Lead compounds; Semiconductor device packaging; Sockets; Surface-mount technology; Testing; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN
0-930815-39-4
Type
conf
DOI
10.1109/ICMCM.1994.753597
Filename
753597
Link To Document