Title :
Cost effective ceramic surface mount packaging for high I/O applications
Author_Institution :
Commercial Plus Technologies Operation, Arizona
Keywords :
Ceramics industry; Costs; Electronics packaging; Fatigue; Lead compounds; Semiconductor device packaging; Sockets; Surface-mount technology; Testing; Wiring;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753597
