DocumentCode :
2663659
Title :
Effects of Ceramic Ball-Grid-Array Package´s Manufacturing Variations on Solder Joint Reliability
Author :
Ju, T.H. ; Lee, Y.C.
Author_Institution :
University of Colorado - Boulder
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
514
Lastpage :
519
Keywords :
Ceramics; Computer aided manufacturing; Electronics packaging; Fatigue; Grid computing; Mechanical engineering; Predictive models; Soldering; Virtual manufacturing; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753599
Filename :
753599
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663659
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