Title :
Construction of Mother Boards Interconnecting Mcm´s
Author :
Buck, Thomas J. ; Motazedi, Marc ; Messner, George
Author_Institution :
Advanced Interconnection Technology, NY
Keywords :
Connectors; Electronics packaging; Gold; Integrated circuit interconnections; LAN interconnection; Military computing; Multichip modules; Printed circuits; Propagation delay; Signal processing;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753600