Title :
Reliability Comparison of Two Metallurgies for Ceramic Ball Grid Array
Author :
Banks, Donald R. ; Bunette, T.E. ; Gerke, R. David ; Mammo, Ephraim ; Mattay, Shyam
Author_Institution :
Motorola, Inc., Texas
Keywords :
Assembly; Capacitive sensors; Ceramics; Copper; Electronics packaging; Failure analysis; Fatigue; Manufacturing processes; Soldering; Tin;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753601
