• DocumentCode
    2663750
  • Title

    Choosing an Mcm Technology for Thermal Performance

  • Author

    Demmin, Jeffrey C.

  • Author_Institution
    nCHIP, Inc., CA
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    549
  • Lastpage
    554
  • Keywords
    Ceramics; Dielectric materials; Dielectric substrates; Dielectric thin films; Finite element methods; Multichip modules; Packaging; Performance analysis; Thermal conductivity; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753604
  • Filename
    753604
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2663750