Title :
A Twenty-Seven Chip MCM-C
Author :
Amerson, Rick ; Kuekes, Phil
Author_Institution :
Hewlett-Packard Laboratories, California
Keywords :
Bonding; Costs; Electronics packaging; Integrated circuit interconnections; Laboratories; Manufacturing; Pins; Printed circuits; Routing; Wires;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753609
