DocumentCode

2663819

Title

A Twenty-Seven Chip MCM-C

Author

Amerson, Rick ; Kuekes, Phil

Author_Institution

Hewlett-Packard Laboratories, California

fYear

1994

fDate

13-15 Apr 1994

Firstpage

578

Lastpage

582

Keywords

Bonding; Costs; Electronics packaging; Integrated circuit interconnections; Laboratories; Manufacturing; Pins; Printed circuits; Routing; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753609

Filename

753609