DocumentCode :
2663830
Title :
A 50mhz Multichip Processor Module With Flip Chip Technology
Author :
Miller, Bill ; Volkringer, Nick ; Su, Lo-Soun ; Ting, Yee Ming ; Loo, Mike ; Kumar, Ramesh ; Smith, Bruce
Author_Institution :
IBM Corporation, N.Y.
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
583
Lastpage :
590
Keywords :
Electronic packaging thermal management; Electronics packaging; Flip chip; Foundries; Integrated circuit interconnections; Microelectronics; Multichip modules; Signal design; Sun; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753610
Filename :
753610
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663830
