Title :
Integrated Brazed Ltcc Packages
Author :
Kovacs, Alan L. ; Elwell, Dennis F.
Author_Institution :
Hughes Aircraft Company, California
Keywords :
Aerospace electronics; Aircraft; Ceramics; Costs; Microelectronics; Packaging; Routing; Sealing materials; Seals; Temperature;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753613
