DocumentCode :
2663869
Title :
Dual-use Microelectronics Manufacturing Specification for Single and Multichip Packaging Technologies
Author :
Gorniak, Mark J. ; Fayette, Daniel F. ; Farrell, J.P.
Author_Institution :
Rome Laboratory, NY
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
597
Lastpage :
602
Keywords :
Gallium arsenide; Hybrid integrated circuits; Laboratories; Manufacturing industries; Microelectronics; Multichip modules; Plastic packaging; Qualifications; Quality assurance; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753614
Filename :
753614
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663869
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