Title :
A Large Area, 3-D Stackable, Mcm-D on C Signal Processor
Author_Institution :
Raytheon, Missile Systems Division, MA
Keywords :
Backplanes; Costs; Integrated circuit interconnections; Missiles; Packaging; Polymers; Signal processing; Stacking; Substrates; Very large scale integration;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753615
