• DocumentCode
    2663886
  • Title

    A Large Area, 3-D Stackable, Mcm-D on C Signal Processor

  • Author

    Arndt, Leon E.

  • Author_Institution
    Raytheon, Missile Systems Division, MA
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    603
  • Lastpage
    611
  • Keywords
    Backplanes; Costs; Integrated circuit interconnections; Missiles; Packaging; Polymers; Signal processing; Stacking; Substrates; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753615
  • Filename
    753615
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2663886