Title :
Ltcc Mcm Technology for Military Environments
Author :
Schroeder, Donald R. ; Rexing, Larry J.
Author_Institution :
CTS Corporation, Microelectronics, Indiana
Keywords :
Bonding; Conducting materials; Guidelines; Military standards; Optical materials; Packaging; Sheet materials; Substrates; Thick films; Wire;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753616
