DocumentCode

2663898

Title

Ltcc Mcm Technology for Military Environments

Author

Schroeder, Donald R. ; Rexing, Larry J.

Author_Institution

CTS Corporation, Microelectronics, Indiana

fYear

1994

fDate

13-15 Apr 1994

Firstpage

612

Lastpage

617

Keywords

Bonding; Conducting materials; Guidelines; Military standards; Optical materials; Packaging; Sheet materials; Substrates; Thick films; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753616

Filename

753616