Title :
Active Silicon Substrate Multi-Chip Module Technology for Sensor Signal Processing and Control
Author :
Pearson, Richard E.
Author_Institution :
Lockheed Missiles & Space Company, Inc., California
Keywords :
Copper; Dielectric substrates; Driver circuits; Integrated circuit interconnections; Missiles; Process control; Signal processing; Silicon; Space technology; Vehicles;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753617
