Title :
Glowing contact areas in loose copper wire connections
Author :
Sletbak, J. ; Kristensen, R. ; Sundklakk, H. ; Nävik, G. ; Runde, M.
Author_Institution :
Norwegian Inst. of Technol., Trondheim, Norway
Abstract :
Laboratory experiments have shown that, when a current-carrying, loose copper wire connection is exposed to mechanical vibrations, a layer of Cu/sub 2/O grows to form a bridge between the contact members, bonding them to one another. Due to the strongly negative temperature coefficient of Cu/sub 2/O at high temperatures, the current is concentrated in a thin, glowing filament at or near the surface of the oxide bridge. The maximum temperature of this filament was found to be 1200-1300 degrees C. Under the action of this hot filament a rapid oxidation of the copper continues until, in the end, most of the circumference of the copper wires has been converted to Cu/sub 2/O to a depth of a few tenths of a mm. As the corrosion proceeds the power dissipation increases to values which can cause fire hazards if a similar situation occurs in electrical apparatus or installations. According to statistics, loose connections or broken wires are known to be the cause of many fires. The phenomenon described explains how a temperature high enough to initiate a fire can arise even when the current through the connection is limited by the load impedance to values of less than 1 ampere.<>
Keywords :
building wiring; copper; copper compounds; electrical contacts; fires; safety; wires (electric); 1 A; 1200 to 1300 C; Cu/sub 2/O layer growth; broken wires; building wiring; current concentration; fire hazards; glowing contact areas; glowing filament; high temperatures; laboratory experiments; loose Cu wire connections; loose connections; mechanical vibrations; negative temperature coefficient; power dissipation; rapid oxidation; Bonding; Bridges; Copper; Corrosion; Fires; Laboratories; Oxidation; Temperature; Vibrations; Wire;
Conference_Titel :
Electrical Contacts, 1991. Proceedings of the Thirty-Seventh IEEE Holm Conference on
Conference_Location :
Chicago, IL, USA
Print_ISBN :
0-7803-0231-1
DOI :
10.1109/HOLM.1991.170830