DocumentCode :
2663935
Title :
Demonstration of a High Heat Removal Cvd Diamond Substrate Edge-Cooled Multichip Module
Author :
Peterson, David W. ; Sweet, James N. ; Andaleon, David D. ; Renzi, Ronald F. ; Johnson, Donald R.
Author_Institution :
Sandia National Laboratories, NM
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
624
Lastpage :
630
Keywords :
Heat transfer; Laboratories; Materials testing; Multichip modules; Substrates; Temperature measurement; Temperature sensors; Thermal conductivity; Thermal management; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753618
Filename :
753618
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663935
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