The current state of laminate based, molded MCM technology

Author

Rogren, Philip E.

Author_Institution

Hestia Technol., Sunnyvale, CA, USA

fYear

1993

fDate

4-6 Oct 1993

Firstpage

485

Lastpage

489

Abstract

Laminate technology has progressed to the point where it is capable of producing multichip module (MCM) substrates that can compete favorably with both cofire ceramic and thin film. By virtue of the properties of the materials set and flexibility of the process, laminate based MCM offer superior electrical performance. Laminates can be expected to be faster than either cofire ceramic or thin film and will be significantly less noise than ceramic based MCMs. In terms of thermal performance, several levels of thermal enhancements available on laminate substrates keep pace with similar methods available for ceramic or metal packages

Keywords

economics; integrated circuit interconnections; integrated circuit manufacture; integrated circuit packaging; integrated circuit reliability; laminates; multichip modules; plastic packaging; reviews; substrates; cost; electrical performance; laminate based; laminate substrates; molded MCM technology; reliability; thermal enhancements; thermal performance; Ceramics; Circuits; Costs; Laminates; Plastics; Protection; Semiconductor device packaging; Substrates; Thermal conductivity; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398158

Filename

398158