A low-cost multichip (MCM-L) packaging solution

Author

Nachnani, M. ; Nguyen, L. ; Bayan, J. ; Takiar, H.

Author_Institution

Nat. Semicond. Corp., Santa Clara, CA, USA

fYear

1993

fDate

4-6 Oct 1993

Firstpage

464

Lastpage

470

Abstract

The concept of multichip module on laminated substrates (MCM-L) is being used in addressing high speed problems at a cost effective manner. One of the major problems associated with high speeds is the delta-I noise or the Ldi/dt noise due to the simultaneous switching of multiple outputs in digital circuits. An MCM-L layout approach that helps in reducing the signal delays, as well as decreasing the Ldi/dt noise by reducing the effective ground inductance without the use of a separate ground plane is described. Modeling and analytical techniques are used to characterize the ground path inductance in a single chip package, and to define the width of the ground trade in the MCM-L for optimal ground path inductance

Keywords

circuit layout CAD; equivalent circuits; inductance; integrated circuit layout; integrated circuit modelling; integrated circuit packaging; laminates; method of moments; multichip modules; substrates; CAD; Ldi/dt noise; MCM-L; delta-I noise; effective ground inductance; equivalent circuits; ground path inductance; laminated substrates; layout approach; low-cost; method of moments based software tool; multiple outputs; simultaneous switching; single chip package; Analytical models; Circuit noise; Costs; Delay effects; Digital circuits; Inductance; Multichip modules; Noise reduction; Packaging; Switching circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398163

Filename

398163