• DocumentCode
    2665306
  • Title

    Laminate substrates for high speed interconnect

  • Author

    Roszel, Lynn

  • Author_Institution
    Texas Instruments, Inc., Dallas, TX, USA
  • fYear
    1993
  • fDate
    4-6 Oct 1993
  • Firstpage
    423
  • Lastpage
    426
  • Abstract
    An existing dual C40 multichip module (MCM) design, constructed in thin film HDI on ceramic is compared with the design converted to a laminate interconnect. The resulting design combines the low cost laminate substrate with increased power distribution and fine interconnect geometries
  • Keywords
    laminates; multichip modules; printed circuit design; substrates; PWB concept; ceramic; dual C40 multichip module; fine interconnect geometries; high speed interconnect; increased power distribution; laminate interconnect; low cost laminate substrate; thin film HDI; Ceramics; Costs; Dielectric substrates; Instruments; Integrated circuit interconnections; Laminates; Optical design; Packaging; Pins; Resists;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    0-7803-1424-7
  • Type

    conf

  • DOI
    10.1109/IEMT.1993.398171
  • Filename
    398171
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2665306