• DocumentCode
    2665597
  • Title

    A research study to establish the need to implement cycle time reduction strategies for new package introduction

  • Author

    Goetsch, Michael

  • Author_Institution
    Intel Corp., Chandler, AZ, USA
  • fYear
    1993
  • fDate
    4-6 Oct 1993
  • Firstpage
    309
  • Lastpage
    316
  • Abstract
    The research is an ex-post facto design administered to a randomly sampled population of the assembly technology groups within one large semiconductor company. The results confirm the fact that cycle time reduction strategies need to be managed more effectively. The areas determined to be of greatest need and importance are organizational structure and development methodology. Recommended strategies include removal of barriers between functional groups, rigorous application of team building sessions, regular project updates, priority reviews for design, development, and manufacturing personnel, and delegating routine decisions to lower-level personnel. Training programs for manufacturing personnel should be made a high priority in the development phase, and rigorous requirements for technology transfer, including detailed documentation, are necessary to guarantee successful implementation of the new technology
  • Keywords
    economics; electronics industry; packaging; product development; research and development management; strategic planning; technology transfer; training; cycle time reduction strategies; decisions delegation; design; development methodology; documentation; new package introduction; organizational structure; personnel; priority reviews; regular project updates; semiconductor industry; technology transfer; training programs; Assembly; Buildings; Design methodology; Electronics industry; Manufacturing; Personnel; Plastic packaging; Semiconductor device manufacture; Semiconductor device packaging; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    0-7803-1424-7
  • Type

    conf

  • DOI
    10.1109/IEMT.1993.398187
  • Filename
    398187