Title :
An environmental comparison of solder and conductive adhesives for SMT interconnect
Author_Institution :
Dept. of Manuf. Eng., Loughborough Univ. of Technol., UK
Abstract :
The results of a comparative study of traditional tin-lead solder and the alternatives, namely lead free solders and conductive adhesives are presented. The comparison is made in light of impending European legislation for product “ecodesign” and “ecoproduction”, which may later by embodied in legislation. Conductive adhesives appear to present opportunities from an environmental viewpoint
Keywords :
adhesion; conducting polymers; environmental factors; filled polymers; legislation; printed circuit manufacture; soldering; surface mount technology; European legislation; SMT interconnect; SnPb solder; conductive adhesives; ecoproduction; environmental comparison; environmental legislation; filled polymers; life cycle analysis; printed circuit boards; product ecodesign; solder pastes; Chemical industry; Computer aided manufacturing; Conductive adhesives; Environmentally friendly manufacturing techniques; Home appliances; Industrial pollution; Lead; Legislation; Pollution measurement; Surface-mount technology;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398205
