An environmental comparison of solder and conductive adhesives for SMT interconnect

Author

Conway, Paul P.

Author_Institution

Dept. of Manuf. Eng., Loughborough Univ. of Technol., UK

fYear

1993

fDate

4-6 Oct 1993

Firstpage

171

Lastpage

176

Abstract

The results of a comparative study of traditional tin-lead solder and the alternatives, namely lead free solders and conductive adhesives are presented. The comparison is made in light of impending European legislation for product “ecodesign” and “ecoproduction”, which may later by embodied in legislation. Conductive adhesives appear to present opportunities from an environmental viewpoint

Keywords

adhesion; conducting polymers; environmental factors; filled polymers; legislation; printed circuit manufacture; soldering; surface mount technology; European legislation; SMT interconnect; SnPb solder; conductive adhesives; ecoproduction; environmental comparison; environmental legislation; filled polymers; life cycle analysis; printed circuit boards; product ecodesign; solder pastes; Chemical industry; Computer aided manufacturing; Conductive adhesives; Environmentally friendly manufacturing techniques; Home appliances; Industrial pollution; Lead; Legislation; Pollution measurement; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398205

Filename

398205