Title :
Chlorinated solvent elimination in chip capacitor attach using qualification by comparison
Author :
Steele, James A., Jr. ; Gould, Kenneth B. ; Siden, Diane G. ; Simmons, Helen L.
Author_Institution :
Digital Equipment Corp., Hudson, MA, USA
Abstract :
The qualification of a no-clean solder paste eliminate the use of chlorofluorocarbons (CFCs) in semiconductor manufacturing. The no-clean also reduces chemical usage and capital equipment needs. The no-clean paste selection process proves successful. Qualification by comparison provides an effective way to ensure the needed reliability
Keywords :
capacitors; circuit reliability; design of experiments; environmental testing; integrated circuit packaging; life testing; quality control; reflow soldering; surface mount technology; CFC solvent elimination; accelerated tests; ceramic package; chip capacitor attach; design of experiments; dispensability; flux ionic testing; no-clean paste selection; no-clean solder paste; qualification by comparison; reliability; solder reflow; surface insulation resistance testing; Capacitors; Ceramics; Chemical processes; Circuit testing; Cleaning; Costs; Integrated circuit packaging; Manufacturing processes; Qualifications; Solvents;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398206
