Flip chip on board (FCOB) process characterization

Author

Scheifers, Steven M. ; Raleigh, Carl J.

Author_Institution

Corp. Manuf. Res. Center, Schaumburg, IL, USA

fYear

1993

fDate

4-6 Oct 1993

Firstpage

143

Lastpage

156

Abstract

A no clean flux process for flip chip on board is characterized for ionic flux residue and board contamination using a new cleanliness testing system. The benchmarking procedure establishes a correlation of flux residue to thermal shock reliability. Speciation and quantitation of ionic printed wiring board (PWB) constituents permits segregation of incoming board contamination from that caused by the flux. A process window to minimize defects and maximize reliability performance is developed. Methods for performing similar characterization and benchmarking of processes are presented

Keywords

chemical variables measurement; chromatography; circuit reliability; electrochemical analysis; electrophoresis; environmental factors; flip-chip devices; packaging; printed circuit manufacture; process control; reflow soldering; surface contamination; thermal shock; Ionograph; Omegameter; PWB; benchmarking; board contamination; capillary electrophoresis; cleanliness testing system; flip chip on board; ion chromatography; ionic flux residue; no clean flux process; process window; reliability performance; segregation; thermal shock reliability; Assembly; Benchmark testing; Circuit testing; Contamination; Electronics packaging; Flip chip; Manufacturing processes; Pollution measurement; Printed circuits; Solvents;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398208

Filename

398208