DocumentCode
2666056
Title
A new method for measuring the tin content of flip-chip solder bumps
Author
Kato, Haruo ; Ikuzaki, Kunihiko ; Tsujita, Masahiko ; Nakata, Kensuke ; Kobayashi, Tsuneo ; Sano, Yoshiyuki
Author_Institution
Hitachi, LTd., Tokyo, Japan
fYear
1993
fDate
4-6 Oct 1993
Firstpage
114
Lastpage
118
Abstract
A new method for measuring the tin content of flip-chip solder bumps is described. This method uses a combination of gravimetric analysis and fluorescent X-ray spectrometry, which allows it to measure low Sn ratio of less than 2%. It also improves the repeatability to 0.2% compared with 4.3% for conventional methods that use integrated circuit piezoelectric (ICP) atomic emission spectrometry. This method also reduces the measurement time by 75%
Keywords
X-ray fluorescence analysis; chemical variables measurement; flip-chip devices; large scale integration; reflow soldering; tin alloys; weighing; LSI; PbSn; Sn content measurement; flip-chip solder bumps; fluorescent X-ray spectrometry; gravimetric analysis; measurement time; repeatability; Absorption; Atomic layer deposition; Atomic measurements; Calibration; Chemical vapor deposition; Oscillators; Spectroscopy; Thickness control; Thickness measurement; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location
Santa Clara, CA
Print_ISBN
0-7803-1424-7
Type
conf
DOI
10.1109/IEMT.1993.398213
Filename
398213
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