Effect of molding compound/polyimide interfacial chemistry on TSOP delamination

Author

Hagen, Debbie ; Prack, Ed ; Tran, Ziep

Author_Institution

Motorola, Inc., Austin, TX, USA

fYear

1993

fDate

4-6 Oct 1993

Firstpage

87

Lastpage

90

Abstract

The effect of interfacial chemistry on plastic package delamination is investigated. The effect of cleaning treatments, molding compound types and polyimide die coating types is examined. Delamination is induced by subjecting a TSOP package with a large die to a simulated board mounting process. Stressing consists of moisture saturation at 75% RH at room temperature followed by vapor phase reflow. The best combination of materials and processes examined results in a TSOP package with no delamination after moisture saturation and vapor phase reflow

Keywords

adhesion; delamination; environmental degradation; environmental factors; plastic packaging; polymer films; printed circuit manufacture; surface mount technology; TSOP delamination; cleaning treatments; interfacial adhesion; interfacial chemistry; moisture saturation; molding compound types; plastic package delamination; polyimide die coating types; simulated board mounting process; thin SOP; vapor phase reflow; Adhesives; Chemistry; Cleaning; Delamination; Moisture; Packaging; Plastics; Polyimides; Stress; Surface cracks;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398218

Filename

398218