Stress analysis and reliability of chip on board encapsulation technology

Author

Sarbach, P. ; Guerin, L. ; Weber, A. ; Dutoit, M. ; Clot, P.

Author_Institution

Valtronic SA, Les Charbonnieres, Switzerland

fYear

1993

fDate

4-6 Oct 1993

Firstpage

82

Lastpage

86

Abstract

It is shown that polymerization and thermomechanical stresses are important in miniaturized chip on board (COB) modules. COB technology is reliable enough to meet most of the demands from the market if the manufacturer has the process perfectly under control. There are two methods to check finite element method and ensure reliability of such miniaturized structures: (FEM) simulation and measurements with test die. FEM allows predictive calculations of stress which are verified by experiment. The FEM allows easy optimization during the design phase and provides a powerful tool to ensure the quality and reliability of low cost COB multichip modules

Keywords

circuit analysis computing; circuit reliability; encapsulation; environmental factors; finite element analysis; multichip modules; plastic packaging; polymerisation; printed circuit manufacture; reliability theory; stress analysis; surface mount technology; thermal stresses; thermoelasticity; chip on board encapsulation technology; finite element method; miniaturized COB modules; multichip modules; optimization; polymerization; predictive calculations; quality; reliability; stress analysis; test die; thermoelasticity; thermomechanical stresses; Design optimization; Encapsulation; Finite element methods; Manufacturing processes; Polymers; Process control; Semiconductor device measurement; Testing; Thermal stresses; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398219

Filename

398219