• DocumentCode
    2666166
  • Title

    Obtaining high quality VLSI packages with QFD

  • Author

    Pearsall, Kitty ; Raines, Robert ; Schoellmann, Matthew

  • Author_Institution
    IBM, Austin, TX, USA
  • fYear
    1993
  • fDate
    4-6 Oct 1993
  • Firstpage
    76
  • Lastpage
    81
  • Abstract
    Component end users want a high quality, reliable part. However, the expected failure rate, cost etc. may vary from one customer to the next. The amount of control that a packaging vendor is expected to put in place so that he can meet those requirements can be assessed through the implementation of QFD (quality function deployment). One such work effort that strives to use this technique for the definition and subsequent optimization of these controls for delivering high quality PQFP´s (plastic quad flat packs) is described
  • Keywords
    VLSI; integrated circuit packaging; plastic packaging; quality control; high quality VLSI packages; plastic quad flat packs; quality function deployment; Assembly; Electronics packaging; Manufacturing processes; Plastic packaging; Process control; Qualifications; Quality function deployment; Reliability engineering; Testing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    0-7803-1424-7
  • Type

    conf

  • DOI
    10.1109/IEMT.1993.398220
  • Filename
    398220