No clean mass reflow of large over molded plastic pad array carriers (OMPAC)

Author

Lau, J. ; Miremadi, J. ; Gleason, J. ; Haven, R. ; Ottoboni, S. ; Mimura, S.

Author_Institution

Hewlett-Packard Co., Palo Alto, CA, USA

fYear

1993

fDate

4-6 Oct 1993

Firstpage

63

Lastpage

75

Abstract

A no clean mass reflow process for 396-pin, 324-pin, and 225-pin over molded plastic pad array carriers (OMPAC) is presented. Emphasis is placed on the OMPAC assembly parameters, such as the design, material, and process of the packages and printed circuit board (PCB), solder paste, stencil design, printing technology, pick and place, mass reflow, and inspection. Cross sections and the "popcorn" effect of the OMPAC assembly are discussed

Keywords

fine-pitch technology; integrated circuit packaging; plastic packaging; printed circuit manufacture; reflow soldering; OMPAC assembly parameters; PCB; SMT; ball grid array; fine pitch; inspection; large over molded plastic pad array carriers; no clean mass reflow process; pick and place; popcorn effect; printing technology; solder paste; stencil design; Assembly; Atherosclerosis; Ceramics; Electronics packaging; Lead; Pins; Plastics; Sliding mode control; Soldering; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398221

Filename

398221