DocumentCode :
2666226
Title :
VMOS, UMOS technology simulation
Author :
Kersys, T. ; Andriukaitis, D. ; Anilionis, R.
Author_Institution :
Dept. of Electron. Eng., Kaunas Univ. of Technol.
fYear :
0
fDate :
0-0 0
Firstpage :
537
Lastpage :
542
Abstract :
VMOS, UMOS ("V"-groove-metal-oxide-silicon) transistors drain and gate are formed in the groove of "V" or "U" form. Expanding channel area, therefore VMOS and UMOS structures may use in the power chips. Using VMOS, UMOS is saving 40% free space than using NMOS technology. Nanostructures dimensions are very small, so it is important to keep pn junction in a right depth, in the all semiconductor manufacturing technological process. Analyzing influence to forming structure of each technological operation is used mathematical simulation program SUPREM IV. VMOS and UMOS technological operation was simulated in micro and nano level
Keywords :
MOSFET; nanotechnology; semiconductor device manufacture; semiconductor process modelling; U-groove-metal-oxide-silicon; V-groove-metal-oxide-silicon; mathematical simulation program; nanostructure dimension; nanotechnology; pn junction; power chip; semiconductor manufacturing technological process; transistor; Analytical models; Boron; Doping; Ion implantation; Manufacturing processes; Semiconductor process modeling; Silicon; Space technology; Substrates; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information Technology Interfaces, 2006. 28th International Conference on
Conference_Location :
Cavtat/Dubrovnik
ISSN :
1330-1012
Print_ISBN :
953-7138-05-4
Type :
conf
DOI :
10.1109/ITI.2006.1708538
Filename :
1708538
Link To Document :
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