Fine pitch gold ball bonding optimization

Author

Shu, William K.

Author_Institution

VLSI Technol., Inc., San Jose, CA, USA

fYear

1993

fDate

4-6 Oct 1993

Firstpage

37

Lastpage

44

Abstract

Response surface methodology is used to characterize a state-of-the-art wire bonder with a bottleneck capillary for fine pitch bonding. Regression analysis generates mathematical models to plot 3-D charts and contour charts of ball size and ball shear force as a function of wire bond parameters. A procedure is described to use contour charts to optimize bonding parameters. Bonding windows are identified by using bonding specification requirements and material/process constraints as boundary conditions

Keywords

circuit optimisation; data visualisation; design of experiments; fine-pitch technology; integrated circuit yield; lead bonding; statistical analysis; statistical process control; 3-D charts; Au ball bonding; ball bonding optimization; ball shear force; ball size; bonding windows; bottleneck capillary; boundary conditions; contour charts; fine pitch bonding; process constraints; regression analysis; response surface methodology; specification requirements; statistical design of experiment; wire bond parameters; wire bonder; Assembly; Bonding forces; Boundary conditions; Costs; Gold; Neck; Regression analysis; Response surface methodology; Very large scale integration; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398224

Filename

398224